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pc filament silk filament





pc filament silk filament










Accessory Compatibility































Recommended Not Recommended
Build Plate Smooth PEI Plate, Textured PEI Plate Cool Plate SuperTack
Hotend All Size / Material /
Glue Glue Stick Bambu Liquid Glue









RFID for Intelligent Printing


All printing parameters are embedded in RFID, which can be read through our AMS (Automatic Material System).


Load and print! No more tedious setting steps.





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Recommended Printing Settings
Drying Settings (Blast Drying Oven) 80 °C,8h
Printing and Keeping Container's Humidity < 20% RH (Sealed, with Desiccant)
Nozzle Temperature 250 - 270 °C
Bed Temperature (with Glue) 90 - 110 °C
Printing Speed < 300 mm/s

































Physical Properties
Density 1.20 g/cm³
Vicat Softening Temperature 119 °C
Heat Deflection Temperature 117 °C
Melting Temperature 228 °C
Melt Index 32.2 ± 2.9 g/10 min

































Mechanical Properties
Tensile Strength 55 ± 4 MPa
Breaking Elongation Rate 3.8 ± 0.3 %
Bending Modulus 2310 ± 70 MPa
Bending Strength 108 ± 4 MPa
Impact Strength 34.8 ± 2.1 kJ/m²












Printing Tips:


• Due to the transparent properties of the filament, Lidar Extrusion Calibration can be affected when printing Transparent PC.


• Bambu PC needs proper drying before printing, recommended drying temperature is 80 ℃ for 8 hours in a blast drying oven, or 100 ℃ for 12 hours on a printer's heatbed. For more details please refer to: Filament drying cover on WIKI.







What's in the Box







PC PC

Filament*1 & Desiccant*1







pla basic pla basic

Package*1












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